Copper Bonded Plates economically replaces pure copper plates with its inherent advantages due to the combination of nickel sealed low carbon steel and copper. The Copper Coating provides good resistance against corrosion as 99.9% Pure Electrolytic Grade Copper is molecularly bonded to Superior Quality Nickel Sealed Cold Rolled Steel.
Features
Best suited for filled topsoil
99.95% Electrolytical Grade Copper
Standard Coating Thickness: 100/250microns
Technical Specifications
| Specifications | Details |
|---|---|
| Base Material | Cold Rolled Steel (Tata/Jindal) |
| Base Coating Material | Nickel |
| Coating Material | 99.9% Pure Electrolytic Grade Copper Anode (Mitsubishi Luvata Japan) |
| Coating Thickness | 250/100 Microns (avg.) |
| Dimension | 2ft X 2ft |
| Available Thickness | 6mm |
| Strip Dimension (optional) | 25mm x 3mm |
| Dimension of Water Hole Pipe (optional) | Hot Dip GI Pipe 25mm Dia |
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