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Copper Bonded Plate

Copper Bonded Plates economically replaces pure copper plates with its inherent advantages due to the combination of nickel sealed low carbon steel and copper. The Copper Coating provides good resistance against corrosion as 99.9% Pure Electrolytic Grade Copper is molecularly bonded to Superior Quality Nickel Sealed Cold Rolled Steel.

  • Description
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Features

Best suited for filled topsoil

99.95% Electrolytical Grade Copper

Standard Coating Thickness: 100/250microns

Technical Specifications

Specifications Details
Base Material Cold Rolled Steel
(Tata/Jindal)
Base Coating Material Nickel
Coating Material 99.9% Pure Electrolytic Grade Copper Anode 
(Mitsubishi Luvata Japan)
Coating Thickness 250/100 Microns (avg.)
Dimension 2ft X 2ft
Available Thickness 6mm
Strip Dimension (optional) 25mm x 3mm
Dimension of Water Hole Pipe (optional) Hot Dip GI Pipe 25mm Dia